- 関
- bump
WordNet
- dance erotically or dance with the pelvis thrust forward; "bump and grind"
- a lump on the body caused by a blow
- knock against with force or violence; "My car bumped into the tree" (同)knock
PrepTutorEJDIC
- 衝突;ごつんと当たること / ゴツン,ドスン[という音] / 打ちこぶ / ばたんと,どしんと / …‘に'突き当たる,ぶち当たる;(…に)…'を'突き当てる《+『名』+『on(『against』)+『名』》 / (…に)突き当たる《+『into』(『against』)+『名』》 / 《副詞[句]を伴って》〈車が〉ガタガタ揺れて通る
Wikipedia preview
出典(authority):フリー百科事典『ウィキペディア(Wikipedia)』「2015/01/14 14:29:10」(JST)
[Wiki en表示]
Bumping may refer to:
- Bumping (chemistry), the irregular boiling of a liquid
- Lock bumping, a lock picking technique
- Bumping Lake, Washington state, United States
- Bumping River, which flows into Bumping Lake
See also
UpToDate Contents
全文を閲覧するには購読必要です。 To read the full text you will need to subscribe.
English Journal
- A memory advantage for property.
- DeScioli P1, Rosa NM2, Gutchess AH3.
- Evolutionary psychology : an international journal of evolutionary approaches to psychology and behavior.Evol Psychol.2015 May 18;13(2):411-23.
- People's access to resources depends on their status as the owner of particular items. To respect property, people need to remember who owns which objects. We test the hypothesis that people possess enhanced memory for ownership relations compared to unrelated objects. Participants viewed a sequence
- PMID 25986536
- Validity of a Trunk Mounted Accelerometer to Measure Physical Collisions in Contact Sports.
- Wundersitz D WT1, Gastin PB, Robertson SJ, Netto KJ.
- International journal of sports physiology and performance.Int J Sports Physiol Perform.2015 Apr 7. [Epub ahead of print]
- CONTEXT: Accelerometer peak impact accelerations are being used to measure player physical demands in contact sports. However, their accuracy to do so has not been ascertained.PURPOSE: To compare peak impact acceleration data from an accelerometer contained within a wearable tracking device with a t
- PMID 25849648
- Laser-induced forward transfer for flip-chip packaging of single dies.
- Kaur KS1, Van Steenberge G2.
- Journal of visualized experiments : JoVE.J Vis Exp.2015 Mar 20;(97). doi: 10.3791/52623.
- Flip-chip (FC) packaging is a key technology for realizing high performance, ultra-miniaturized and high-density circuits in the micro-electronics industry. In this technique the chip and/or the substrate is bumped and the two are bonded via these conductive bumps. Many bumping techniques have been
- PMID 25867627
Japanese Journal
- 電子情報通信学会誌 = The journal of the Institute of Electronics, Information and Communication Engineers 98(8), 758-761, 2015-08
- NAID 40020553315
- 塗布法で作製したBi-2212相超電導厚膜の平滑性向上とピンニングセンタ導入による高Ic化
- 日本高専学会誌 : journal of the Japan Association for College of Technology 20(3), 35-38, 2015-07-31
- NAID 110009984909
- Active control of beams by metallic nanoslit array lens with movable dielectric substrate
Related Links
- bumpingとは。意味や和訳。[名]《航空》バンピング:座席数以上の予約受けつけをしてはみだした乗客の搭乗を断ること. ⇒BUMP(他)3bumping compensation予約取り消し補償. - goo英和辞書は14万項目以上を収録し、発音、音声 ...
- bumping him into the wall he bore down upon him growling in a voice obviously assumed and grossly piratical: "Sit there!" ... bumping” is common in open boiling when the liquid is free from air bubbles and the interior of the vessel is ...
Related Pictures
★リンクテーブル★
[★]
- 関
- bumping